Iacdrive|Automation Solution

flyback & boost applications

For flyback & boost applications, powder cores such as Kool-mu, Xmu, etc… are usually best performing and lowest cost. Even these may need to be gapped and if CCM operation is required, a “stepped-gap” is preferred to allow a large load compliance. Center stepped gaps reduce the fringe flux greatly as there is never a complete gap, only localized saturation. This permits the inductor’s value to “swing” more and accommodate the required operation.
With only the center leg with a gap, the outer copper band can be applied without significant loss.

To explore further, dissimilar core materials can be used in parallel, ferrite & powdered types, such that different materials provide function at different operating points within the same construction. Some decades ago, we had some high power projects that utilized fixed magnets within a ferrite’s gap to provide a flux bias offset for a forward topology.

Abe Pressman wasn’t big on exploring magnetic losses, however he operated at lower frequencies than are typical today. MPPs are great with large DC bias, but suffer high loss if AC swing is large and fast. Toroids also have the least efficient winding window, however, they are best to mitigate emi.

Switching frequency selection

Switching frequency selection is actually a tradeoff, and follows the below guidelines:

Lower frequency (Eg 30kHz) means bulkier magnetics and capacitors; Higher frequency (Eg 1Mhz)) means smaller parts, hence more compact PSU.
Stay away from exact 150kHz as this is the low end of any EMI compliance; So, if your frequency happens to be exactly 150kHz, then your PSU will be a strong emitter; For many commercial low cost PSUs, 100 KHz has been used for many years, which is why many inductors and capacitors are specified at 100kHz.
Higher frequency >/= 1MHz converters provide for better transient response. Obviously, the control IC should be capable of supporting. There are plenty of resonant converters available.
Higher frequency results in higher switching losses; To control that, you will need faster switching FETs, Diodes, capacitors, magnetics and control ICs.
Higher frequency MAY result in more broadband noise; its not always true, since noise can be controlled by good PCB layout and good magnetics designs.

Board power DC/DC converters are commonly built using 1MHz switchers.
Chassis power Telecom/Server PSUs seem to stay with 100-300KHz range.

Manufacturers are able to achieve exceptional density by virtue of High frequency resonant topologies, but they have to achieve high efficiencies too; Else, they will generate so much heat that they cannot meet UL/IEC safety requirements.
In some cases, they will leave the thermal problem to the user. Usually, the first few paragraphs of any reference design discusses the tradeoffs.

Determine coefficient of grounding

Determination of required grounding impedance is based on determination of coefficient of grounding which represents ratio of maximum phase voltage at phases which aren’t exposed by fault and line voltage of power network:

kuz=(1/(sqrt(3)))*max{|e(-j*2*π/3)+(1-z)/(2+z)|; |e(+j*2*π/3)+(1-z)/(2+z)|}
z=Z0e/Zde

where are:

kuz-coefficient of grounding,
z-ratio of equivalent zero sequence impedance viewed from angle of place of fault and equivalent direct sequence impedance viewed from angle of place of fault,
Z0e-equivalent zero sequence impedance viewed from angle of place of fault,
Zde-equivalent direct sequence impedance viewed from angle of place of fault.

So, after this explanation, you can get next conclusions:
if kuz=1 then power network is ungrounded because Z0e→∞, which is a consequence of existing more (auto) transformers with ungrounded neutral point than (auto) transformers with grounded neutral point (when kuz=1 then there aren’t (auto) transformers with grounded neutral point),
if kuz≤0,8 then power network is grounded because Z0e=Zde, which is a consequence of of existing more (auto) transformers with grounded neutral point than (auto) transformers with ungrounded neutral point.

Fault current in grounded power networks is higher than fault current in ungrounded power networks. By other side, in case of ungrounded power networks we have overvoltages at phases which aren’t exposed by fault, so insulation of this conductors could be seriously damaged or in best case it could become older in shorter time than it is provided by design what is the main reason for grounding of power networks.
Coefficient of grounding is very important in aspect of selecting of insulation of lighting arresters and breaking power of breakers, because of two next reasons:
1. in grounded power networks insulation level is lower than insulation level in ungrounded power networks,
2. in grounded power networks value of short circuit current is higher than value of short circuit current in ungrounded power networks.

Hysteretic controller

We can see that the hysteretic controller is a special case of other control techniques. For example, “sliding mode control” usually uses two state variables to determine one switching variable (switch ON or OFF). So the hysteretic controller is a special case of “1-dimensional” sliding mode. In general, there are many techniques under the name of “geometric control” that can be used to prove the stability of a general N-state system under a given switching rule. So I believe that you can apply some of these techniques to prove the stability of the hysteretic controller, although I have not tried to do this myself. The book “elements of power electronics” by Krein discusses that in chapter 17.

But I can talk more about one technique that I have used and in my opinion is the most general and elegant technique for non-linear systems. It is based on Lyapunov stability theory. You can use this technique to determine a switching rule to a general circuit with an arbitrary number of switches and state variables. It can be applied to the simple case of the hysteretic controller (i.e. 1 state variable, 1 switching variable) to verify if the system is stable and what are the conditions for stability. I have done this and verified that it is possible to prove the stability of hysteretic controllers, imposing very weak constraints (and, of course, no linearization needed). In a nutshell, to prove the system stable, you have to find a Lyapunov function for it.

What can expand is to go beyond a simple window comparator for hysteretic control.

#1) control bands, or switching limits can be variable and also part of a loop, especially if one wants to guarantee a nearly fixed frequency.

#2) using a latch or double latch after the comparator(s), one can define (remember) the state and define operations such as incorporating fixed Ton or Toff periods for additional time control… this permits the “voltage boost” scenario you previously said could not be done. This also prevents common “chaos” operation and noise susceptibility that others experience with simpler circuits.

#3) additional logic can assure multiphase topologies locked to a system clock and compete very well with typical POL buck regulators for high-end processors that require high di/dt response.

Time or state domain control systems such as this, can have great advantages over typical topologies. There really is no faster control method that provides a quicker load response without complete predictive processing, yet that can also be applied to hysteretic control.

What causes VFD driven motor bearing current?

There are several things involved, all with varying degrees of impact.

Large machines are – generally speaking – made of pieces (segments) because the circle for the stator and/or rotor core is too large to manufacture from a single sheet. This leads to some breaks in the magnetic flux path symmetry, both in the radial (right angles to the shaft) and axial (parallel to the shaft) directions.

For the most part, the windings of large machines are formed and installed by hand. This too can lead to symmetry issues, as the current paths are not identical which in turn will create some differences in the magnetic field flux.

Output waveforms from power electronics are only approximations of true sinusoids. The presence of additional harmonics distorts the sinusoidal nature and results in changes that are not symmetric in the magnetic field strength … which in turn means a non-symmetric flux distribution.

Two other items contribute to potentially damaging bearing currents as well. One of these is the Common Mode Voltage which is present (to some degree) in all drives. Essentially this is a signal that is present at both the drive input and output … I tend to think of it as an offset. It’s not something that traditional grounding addresses, and can create an elevated potential in the shaft which then discharges through the bearing path.

A second item is not related to the presence (or absence) of drives at all; it is related to the mechanical arrangement of the process drive train. For example, a shaft that has a sliding seal (like the felt curtain on a dryer section), or one that turns a blade against a gas or liquid (like a compressor) can generate a static charge at the point of contact. If there is no means of isolating this charge to the portion of the shaft where the sliding is occurring, it can pass through to the motor shaft and thence through the motor bearings.

Lastly – the frequency of the variable frequency drive harmonics in the output waveform is significantly higher than line frequency. This requires specific accommodations for grounding as traditional methods are insufficient due to the attenuation caused by the relatively high resistance ground path.

Constant on-time control

There are three different more or less widely used types of constant on-time control. The first one is where the off-time is varied with an error signal. A loop with this type of control has a control-to-output voltage frequency response (or Bode plot if you prefer) similar to that of the constant-frequency voltage-mode control. The second one is where the off-time is terminated with a comparator that monitors the inductor current, and when that current goes below a level set by the error signal, the switch is turned on. This control (also called constant on-time valley-current control) has a control-to-output voltage frequency response similar to the constant-frequency valley-current control. The main difference is that its inner current-control loop does not suffer from the subharmonic instability of the constant-frequency version, so it does not require a stabilizing ramp and the control-to-output voltage response does not show the half-frequency peaking. The third version is where the off-time is terminated when the output voltage (or a fraction of it) goes below the reference voltage. This control belongs to the family of ripple-based controls and it cannot be characterized with the usual averaging-based control-to-output frequency response, for the reason that the gain is affected by the output ripple voltage itself.

As for the hysteretic control, the current-mode version is a close relative of the constant on-time valley-current-control. The version that uses the output ripple voltage instead of the inductor current ripple for turning on and off the switch (also called “hysteretic regulator”) is a close relative of the constant on-time ripple-based control.

Although the ripple-based control loops cannot be characterized with the usual Bode plots, the converters can still be unstable, but not in the meaning of the traditional control-loop instability that power-supply engineers are used to. Furthermore the hysteretic regulator is essentially unconditionally stable. The instabilities with ripple-based control are called “fast-scale” because the frequency of the instability is closely related to the switching frequency (either subharmonic, similar to the inner-loop instability of some of the current-mode controller, or chaotic in nature).

The paper I wrote a couple of years ago (“Ripple-Based Control of Switching Regulators—An Overview”) is a good introduction to ripple-based control and discusses some of the stability issues. There are also quite a few papers with detailed analyses on the stability of converters with feedback loops where the ripple content of the feedback signal is significant.

Impedance analyzer

A graphical impedance analyzer with good phase resolution is a must. Some brands have all the bells and whistles, but not the phase resolution necessary to accurately measure high Q (100+) components over the instrument’s full frequency range (which should extend at least into the low megahertz). Of course the Agilent 4294A fills the performance bill, but with a $40k+ purchase bill, it also empties the budget (like similar high end new models from Wayne Kerr). Used models from Wayne Kerr work very well, and can be had for under $10K but they are very heavy and clunky with very ugly (but still useable) displays.

Perhaps the best value may be the Hioki IM3570, which works extremely well with superior phase resolution, has a very nice color touch screen display (with all the expected engineering graphing formats), is compact and lightweight, and costs around $10k new. Its only downside is that its fan is annoyingly loud and does not reduce its noise output during instrument idle.

But where should an impedance analyzer rank on the power electronics design engineer’s basic equipment list (and why)?

Beyond the basic lower cost necessities such as DMMs, bench power supplies, test leads, soldering stations, etcetera, I would rank a good impedance analyzer second only to a good oscilloscope. The impedance analyzer allows one to see all of a component’s secondary impedance characteristics and to directly compare similar components. Often overlooked is the information such an instrument can provide by examining component assemblies in situ in a circuit board assembly. Sometimes this can be very revealing of hidden, but influential layout parasitics.

Equally importantly, an impedance analyzer allows accurate SPICE models to be quickly formulated so that simulation can be used as a meaningful design tool. Transformer magnetizing and leakage inductances can be measured as well as inter-winding capacitance and frequency dependent resistive losses. From these measurements and with proper technique, a model can be formulated that nearly exactly matches the real part. Not only does this allow power circuits and control loops to be initially designed entirely by simulation (under the judicious eye of experience, of course), but it even allows one to effectively simulate the low frequency end of a design’s EMI performance.

FETs in ZVS bridge

Had run into a very serious field failure issue a decade ago due to IXYS FETs used in a phase-shifted ZVS bridge topology. Eventually, the problem was tracked to failure of the FETs’ body diode when the unit operated at higher ambient temperature.

When FETs were first introduced for use in hard switching applications, it was quickly discovered that under high di/dt commutating conditions, the parasitic bipolar transistor that forms the body diode can turn on resulting in catastrophic failure (shorting) of the FET. I had run into this issue in the mid ’80s and if memory serves me correctly, IR was a leader in making their FET body diodes much more robust and capable of hard commutation. Having had this experience with FET commutation failures and after exhausting other lines of investigation which showed no problem with the operation of the ZVS bridge, I built a tester which could establish an adjustable current through the body diode of the FET under test followed by hard commutation of the body diode.

Room temperature testing of the suspect FET showed the body diode recovery characteristic similar to that of what turned out to be a more robust IR FET. Some difference was seen in the diode recovery as the IXYS FET was a bit slower and did show higher recovered charge. However, was unable to induce a failure in either the IXYS or IR FET even when commutating high values of forward diode current up to 20A when testing at room temperature.

The testing was then repeated in a heated condition. This proved to be very informative. The IXYS FETs were found to fail repeatedly with a case temperature around 80C and forward diode current prior to commutation as low as 5A. In contrast, the IR devices were operated to 125C case temp with forward diode currents of 10A without failure.

This confirmed a high temperature operating problem of the IXYS FETs associated with the body diode. Changing to the more robust IR devices solved the field failure issue.
Beware when a FET datasheet does not provide body diode di/dt limits at elevated ambient.

A more complete explanation of the FET body diode failure mechanism in ZVS applications can be found in application note APT9804 published by Advanced Power Technology.

I believe FETs can be reliably used in ZVS applications if the devices are carefully selected and shown to have robust body diode commutation characteristics.

Paralleling IGBT modules

I’m not sure why the IGBTs would share the current since they’re paralleled, unless external circuitry (series inductance, resistance, gate resistors) forces them to do so?

I would be pretty leery of paralleling these modules. As far as the PN diodes go, reverse recovery currents in PN diodes (especially if they are hard switched to a reverse voltage) are usually not limited by their internal semiconductor operation until they reach “soft recovery” (the point where the reverse current decays). They are usually limited by external circuitry (resistance, inductance, IGBT gate resistance). A perfect example: the traditional diode reverse recovery measurement test externally limits the reversing current to a linear falling ramp by using a series inductance. If you could reverse the voltage across the diode in a nanosecond, you would see an enormous reverse current spike.

Even though diode dopings are pretty well controlled these days, carrier lifetimes are not necessarily. Since one diode might “turn off” (go into a soft reverse current decreasing ramp, where the diode actually DOES limit its own current) before the other, you may end up with all the current going through one diode for a least a little while (the motor will look like an inductor, for all intents and purposes, during the diode turn-off). Probably better to control the max diode current externally for each driver.

Paralleling IGBT modules where the IGBT but not the diode has a PTC is commonly done at higher powers. I personally have never done more than 3 x 600A modules in parallel but if you look at things like high power wind then things get very “interesting”. It is all a matter of analysis, good thermal coupling, symmetrical layout and current de-rating. Once you get too many modules in parallel then the de-rating gets out of hand without some kind of passive or active element to ensure current sharing. Then you know it is time to switch to a higher current module or a higher voltage lower current for the same power. The relative proportion of switching losses vs conduction losses also has a big part to play.

Power converter trend

The trend toward lower losses in power converters is not apparent in all of the applications of power converters. It is also not apparent that the power converter solution and its losses for a given market will be the same when it comes to losses. In terms of the market shift that you mention, Prof. the answer is probably that each market is becoming split into a lower efficiency and higher efficiency solution.

From my limited view the reason for this is the effort and time required to do the low loss development. The early developers of low loss converters are now ahead and those that were slower may never catch them. This gap is in a number of converter markets widening, with both higher loss and lower loss offerings continuing to be used and sold. This split is not apparent with different levels of development or geographically.

Some markets already have very efficient solutions, other markets not so efficient and others had high power loss solutions. The customers accepted these solutions. The path to lower loss converters is for some markets not yet clear and in some markets the requirement may never actually become real.

It does seem that there is a real case to make for any power converter market splitting in two as the opportunities presented by lowering the power loss are taken.

All low loss converters present significant challenges and are all somewhat esoteric.

For me power supply EMI control consists of designing filtering for differential and common mode conducted emissions. The differential mode filtering attenuates the primary side differential lower frequency switching current fundamental & harmonic frequencies. The common mode filtering provides a low impedance return path for high frequency noise currents resulting from high dV/dt transitions during switching transitions present on the power semiconductors (switching mosfet drain, rectifier cathods). These noise currents ring at high frequencies as they oscillate in the uncontrolled parasitic inductance and capacitance associated with their return to source path. Shortening and damping this return path allows the high frequency noise currents to return locally instead of via the measurement copper bench and conducted emi current or voltage (LISN) probe as well as providing a more damped ringing frequency. Shorting this return path has the added benefit of decreasing radiated emissions. In addition proper layout of the power train so as to minimize the loop area associated with both the primary and secondary side switching currents minimizes the associated radiated emissions.

When I mentioned the criticism of resonant mode converter as related to the challenges of emi filitering I was referring to the additional differential mode filtering required. For example if you take a square wave primary side current waveform and analyze the differential frequency content the fundamental magnitude with be lower and there will be higher frequency components as compared to a purely resonant approach at the same power level. It is normally the lower frequency content that has to be filtered differentially.

Given these differences the additional emi filtering volume/cost of the resonant approach may pose a disadvantage.